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Inductive Displacement Sensor (EX-V Series) Applications

Measuring vibration in a taping machine Rattling in a taping machine causes displacement or running off of chip components in emboss tape. Industry: IC and Semiconductor Measurement Type: Vibration, Stroke

Checking adhesion of mold press die A fault in die adhesion is caused by displacement of lead frame. High heat resistance performance up to 105°allows direct mounting on a device, allowing high accuracy measurement in high temperature environment. Industry: IC and Semiconductor Measurement Type: Thickness, Positioning

Checking dynamic accuracy of chip mounter Dynamic accuracy of an arm is constantly monitored during equipment operation. Faulty mounting due to a displaced home position is prevented. Ultra-compact sensor head provides excellent flexibility in installation. Industry: IC and Semiconductor,Electrical/Electronics Measurement Type: Vibration, Stroke

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