Rattling in a taping machine causes displacement or running off of chip components in emboss tape.
Industry: IC and Semiconductor Measurement Type: Vibration, Stroke
Checking adhesion of mold press die
A fault in die adhesion is caused by displacement of lead frame. High heat resistance performance up to 105°allows direct mounting on a device, allowing high accuracy measurement in high temperature environment.
Industry: IC and Semiconductor Measurement Type: Thickness, Positioning
Checking dynamic accuracy of chip mounter
Dynamic accuracy of an arm is constantly monitored during equipment operation. Faulty mounting due to a displaced home position is prevented. Ultra-compact sensor head provides excellent flexibility in installation.
Industry: IC and Semiconductor,Electrical/Electronics Measurement Type: Vibration, Stroke