High-accuracy measuring of surface shape allows precise calculation of wearing.
Industry: IC and Semiconductor Measurement Type: Height,Shape
Detection of double or missing chip
The LK series High Accuracy CCD Laser Measurement Sensor is used to detect rising and overlapping of chip components before cover installation. Ultra-compact size allows easy installation in equipment.
Industry: IC and Semiconductor Measurement Type: Distortion, Curvature
Measuring shape of IC resin mold
The shape of a resin mold is measured on a non-contact basis. A state-of-the-art measurement algorithm allows precise measurement of a semi-transparent mold.
Industry: IC and Semiconductor Measurement Type: Height, Shape
Measuring height of BGA ball
The difference in height among solder balls due to warpage of BGA board is measured with high accuracy.
Industry: IC and Semiconductor Measurement Type: Height, Shape
Measuring warpage of a board
Warpage of a board is measured on a non-contact basis. Accurate measurement is possible on the surface of a semi-transparent board.
Industry: IC and Semiconductor Measurement Type: Warpage
Checking wafer position
Checking whether a wafer set on a table is overlapping on a fixing pin.
Industry: IC and Semiconductor Measurement Type: Runout,Height,Curvature
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